发明名称 |
Distributed Metal Routing |
摘要 |
A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias.
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申请公布号 |
US2012181707(A1) |
申请公布日期 |
2012.07.19 |
申请号 |
US201113007235 |
申请日期 |
2011.01.14 |
申请人 |
XIAO YOU-CHENG;CHEN YEN-HUEI;CHEN JUNG-HSUAN;CHOU SHAO-YU;TIEN LI-CHUN;LIAO HUNG-JEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
XIAO YOU-CHENG;CHEN YEN-HUEI;CHEN JUNG-HSUAN;CHOU SHAO-YU;TIEN LI-CHUN;LIAO HUNG-JEN |
分类号 |
H01L23/48;H01L21/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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