| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curing resin composition providing a cured material having low linear expansion, being excellent in heat resistance, wire burying flatness and resin strength. <P>SOLUTION: The curing resin composition includes an alicyclic olefin polymer (A) having a carboxyl group and/or a carboxylic anhydride group, a curing agent (B) having at least two functional group, and an alicyclic olefin structure or a fluorene structure, and an inorganic filler (C), wherein the blend amount of the inorganic filler (C) is 30 to 90 wt.%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
