| 摘要 |
PURPOSE: An epoxy resin composition for sealing semiconductor device is provided to improve adhesion with various materials like a semiconductor device, a lead frame, thereby improving reliability, and crack resistance of a semiconductor device. CONSTITUTION: An epoxy resin composition for sealing semiconductor comprises an epoxy resin, a hardener, a curing accelerator, a coupling agent, inorganic filler, and adhesion improved. The adhesion improved comprises aromatic propionate-based compound in chemical formula 1. In chemical formula 1, R1, R2, R3, R4, R5, R6, R7 , R8 and R9 are same or different each other, and is respectively and independently hydrogen, or C1-C9 alkyl group. The aromatic propionate-based compound is 0.01-5 weight% of based on the epoxy resin.
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