HEAT RADIATION APPARATUS FOR LED PACKAGE AND LED PACKAGE COMPRISING THE SAME

摘要

PURPOSE: A heat sink device for an LED package and an LED package using the same are provided to extend the service life of an LED package. CONSTITUTION: A heat sink device for an LED package is formed on the rear side of a printed circuit board which is electrically connected to an LED light source. The heat sink device comprises a heat sink(230) for dissipating heat produced by an LED light source into the air through spontaneous convection and a plurality of cooling fins(240) vertically arranged in the heat sink. A micro-pattern structure(241) is formed on the outer side of the cooling fins. The cooling fins are formed of a metal material having superior thermal conductivity and elongation.