发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.
|
申请公布号 |
US8207618(B2) |
申请公布日期 |
2012.06.26 |
申请号 |
US20100692872 |
申请日期 |
2010.01.25 |
申请人 |
SHIMIZU KAZUMICHI;TOMURA YOSHIHIRO;ONO MASAHIRO;PANASONIC CORPORATION |
发明人 |
SHIMIZU KAZUMICHI;TOMURA YOSHIHIRO;ONO MASAHIRO |
分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|