| 摘要 |
PURPOSE: A multilayer printed circuit board and a manufacturing method thereof are provided to improve heat dissipation by heating and pressing a heat sink for discharging heat to the outside and a double sided copper laminate. CONSTITUTION: A copper foil laminate plate is formed on both sides of an insulator(100). A circuit pattern is formed in the inner layer of the copper foil laminate plate(101). The upper side of a heat sink is etched along a circuit pattern(102). The copper foil laminate plate and the heat sink are heated and pressed(103). A via hole is formed(104). The via hole is plated with copper(105). A bottom etching unit is formed and the bottom etching unit is filled with resin. A circuit pattern is formed on the outer layer of the copper foil laminate plate(107). A folding part is formed by forming a folding hole on the copper foil laminate plate. |
