| 摘要 |
<p>A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.</p> |
