| 发明名称 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD |
| 摘要 |
A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps. |
| 申请公布号 |
US2012148960(A1) |
申请公布日期 |
2012.06.14 |
| 申请号 |
US201213403380 |
申请日期 |
2012.02.23 |
| 申请人 |
MOK JEE SOO;YOO JE GWANG;LEE EUNG SUEK;RYU CHANG SUP;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MOK JEE SOO;YOO JE GWANG;LEE EUNG SUEK;RYU CHANG SUP |
| 分类号 |
G03F7/20;B82Y30/00;B82Y40/00 |
主分类号 |
G03F7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
