Semiconductor i.e. power semiconductor, for use in direct current power semiconductor of electronic commutated electromotor of motor car, has ceramic layer comprises pores that are filled with thermal conductive medium e.g. adhesive

摘要

The semiconductor (1) has a connector comprising a thermally conductive substrate (3) i.e. copper element. The substrate comprises a coupling surface (4) for indirect thermal coupling with a heat sink (14) i.e. cooling body. The coupling surface is connected with a ceramic layer (5). The ceramic layer comprises a cooling surface (11) on an opposite side of the coupling surface for connecting the ceramic layer with the heat sink. The ceramic layer comprises pores (7) that are filled with thermal conductive medium such as silicon dioxide (10) and adhesive (12) i.e. emulsion bonding adhesive. An independent claim is also included for a method for thermally connecting a semiconductor with a heat sink.