ADHESIVE COMPOSITION

摘要

The present invention relates to an adhesive composition to be used in encapsulating an organic electronic device, an adhesive film, to a method for manufacturing an adhesive film and to an organic electronic device. The adhesive composition can be formed into an encapsulation layer having superior adhesion, impact resistance, heat dissipation and moisture barrier properties, and therefore, the organic electronic device comprising an element encapsulated by the aforementioned adhesive composition may have elongated service life and exhibit superior durability.