发明名称 EXPOSURE EQUIPMENT AND METHOD FOR MANUFACTURING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide exposure equipment capable of measuring a position of a wafer stage with high accuracy. <P>SOLUTION: Exposure equipment comprises a position measuring system having a plurality of heads including a plurality of first heads 65 and 64 provided corresponding to a pair of measurement surfaces extendedly arranged in a Y-axis direction in the vicinity of both end portions of a top surface of a wafer stage in an X-axis direction, respectively, and each having a measuring direction of the X-axis direction, each for emitting a measuring beam to a first irradiation point on the corresponding measurement surface and receiving return light of the measuring beam returned from the measurement surface, the position measuring system for obtaining positional information of the wafer stage at least in an X-Y plane based on outputs from the plurality of heads. The first irradiation point is positioned on a straight line in the X-axis direction passing through the irradiation center of the illumination light. Accordingly, the first head can measure a position of the wafer stage at least in the X-axis direction without an Abbe error. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012089769(A) 申请公布日期 2012.05.10
申请号 JP20100236976 申请日期 2010.10.22
申请人 NIKON CORP 发明人 SHIBAZAKI YUICHI
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
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