| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which achieves an increase in thermal conductivity of a resin cured portion covering a periphery of a soldering portion, thereby achieving improvement of heat dissipation from the cured portion. <P>SOLUTION: The thermosetting resin composition comprises solder particles having a melting point of 240°C or lower, a thermosetting resin binder, an inorganic filler, and as a flux component, an aliphatic carboxylic acid compound having a specific structure with a terminal carboxyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
