METHOD OF PROTECTING POLYIMIDE MATERIALS DURING ETCHING

摘要

FIELD: chemistry. ^ SUBSTANCE: method of protecting polyimide materials during etching involves a process for etching parts of the polyimide material with alkaline solutions. Before the etching process, the polyimide material is covered with a mixture of epoxy-urethane varnish with an oligoester acrylate additive, with the following ratio of components, wt %: epoxy-urethane varnish 93.7-95.2, oligoester acrylate 4.8-6.3. The part of the polyimide material which is not supposed to be etched is then protected with an insulating layer. ^ EFFECT: providing conditions for etching fully polymerised polyimide which ensure accuracy of the shape and dimensions of the etched areas. ^ 3 ex