发明名称 |
ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT |
摘要 |
An electronic component includes: a semiconductor element including a circuit; a vibration element; a first electrode arranged on a first surface of the semiconductor element and connected to the circuit and the vibration element arranged on the first surface side; a second electrode arranged on the first surface; a first wiring board including a first wire connected to the second electrode; and a second wiring board including a second wire to which the first wire is connected At least a part of an inner side region of an outer contour of the vibration element is arranged to overlap the second electrode in plan view facing the first surface. |
申请公布号 |
US2012080763(A1) |
申请公布日期 |
2012.04.05 |
申请号 |
US201113228989 |
申请日期 |
2011.09.09 |
申请人 |
HANAOKA TERUNAO;SHINDO AKINORI;YAMASAKI YASUO;CHIBA SEIICHI;ENTA TOSHIYUKI;KOJIMA SHUJI;SEIKO EPSON CORPORATION |
发明人 |
HANAOKA TERUNAO;SHINDO AKINORI;YAMASAKI YASUO;CHIBA SEIICHI;ENTA TOSHIYUKI;KOJIMA SHUJI |
分类号 |
H01L29/84;H01L21/02 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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