发明名称 TOOLING MANAGEMENT METHOD OF DIE BONDER, AND DIE BONDER
摘要 <P>PROBLEM TO BE SOLVED: To automate management of tooling, for reduced work of an operator, to prevent wrong attachment of tooling, relating to a die bonder of which exchanging of tooling is possible. <P>SOLUTION: The tooling of a pushing-up unit, a bonding head, and a preform head is attached with an RFID tag in which the information about tooling such as dimension of a die which is to be worked is stored. When attaching the tooling, an operator inputs a manufacture condition about the tooling. When the information about tooling which has been read from the RFID tag using an RFID reader/writer does not agree with the manufacture condition about the tooling, a message indicating attachment error of the tooling is displayed on a monitor. At completion of production, the work history of the tooling is written into the RFID tag using the RFID reader/writer, and it is read at the start of next production, to display a message on the monitor if a specified frequency is exceeded. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012069733(A) 申请公布日期 2012.04.05
申请号 JP20100213207 申请日期 2010.09.24
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 TAKAGI SUSUMU;MAKI HIROSHI
分类号 H01L21/52;H05K13/04 主分类号 H01L21/52
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