| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that rising of an electronic component, which is so-called a rising phenomenon, occurs during reflow for jointing the electronic component to a substrate. <P>SOLUTION: In one embodiment of this invention, an electronic component module includes the electronic component. The electronic component includes: an insulator which has a lower face, a first side face, a second side face located on a side opposite to the first side face, a first recess formed between the lower face and the first side face, and a second recess formed between the lower face and the second side face; a coil-shaped inner conductor embedded in the insulator; a first external electrode arranged in the first recess and electrically connected to one end of the coil-shaped inner conductor; and a second external electrode arranged in the second recess and electrically connected to the other end of the coil-shaped inner conductor. <P>COPYRIGHT: (C)2012,JPO&INPIT |
