| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adjustment method of a substrate processing apparatus capable of adjusting a position of a transport destination of a transport mechanism at low cost with a simple structure. <P>SOLUTION: In an adjustment process, a jig 100 is used instead of a pin 75. The jig 100 includes: a cylindrical trunk 101 that has a diameter of 6 mm and can be fitted into a mounting hole 72a; and a cylindrical head 102 that has a diameter of 8 mm and is formed coaxially with the trunk 101. An operator adjusts the location of a hand H, etc. so that the hand H can mount a wafer W without contacting the jig 100 because the wafer W contacts the jig 100 when the wafer W is mounted on a position that is deviated from a correct position to be mounted on a susceptor 72. <P>COPYRIGHT: (C)2012,JPO&INPIT |
