FILM FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

Provided is an adhesive film with a dicing sheet (1), wherein the adhesive film (12) is laminated on top of a dicing film (11), which has excellent reliability and is readily capable of tip protrusion (tongue protrusion) of a cover film (2) while maintaining a function for suppressing the formation of transfer marks when a film (10) for a semiconductor device, wherein the adhesive film with the dicing sheet is laminated at prescribed intervals on the cover film, is wound into a roll. The film for a semiconductor device of the present invention is a film for a semiconductor device wherein the adhesive film with a dicing sheet, which is the adhesive film laminated on top of a dicing film, is laminated to the cover film at prescribed intervals, and said film for a semiconductor device has an Ea/Eb ratio between the tensile storage modulus (Ea) for the dicing film at 23°C and the tensile storage modulus (Eb) for the cover film at 23°C of 0.001-100.