发明名称 |
Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method |
摘要 |
A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit. |
申请公布号 |
US8130493(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20090389723 |
申请日期 |
2009.02.20 |
申请人 |
NA TAE-KWON;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
NA TAE-KWON |
分类号 |
H05K7/20;F28F7/00;H01L23/34;H05K3/30 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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