Electronic component and method of manufacturing the same

摘要

An electronic component (100) which can be readily miniaturized and made compact, and which has a simple manufacturing process, and a method of manufacturing the same, the electronic component including a printed circuit board (PCB) (110) having a first surface (110a) and a through-hole (110c), a semiconductor device (120) mounted in the through-hole and combined with the first surface of the PCB and at least one passive device combined with the first surface of the PCB and at leat one passive device (130) combined with the first surface of the PCB.