发明名称 CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a circuit board which uses an adhesive having a low hygroscopic property and high heat resistance. SOLUTION: A first circuit member having a first connecting terminal and a second circuit member having a second connecting terminal are arranged with first and second connecting terminals facing each other, and an adhesive is provided between the first and second connecting terminals arranged face to face and is heated and pressed to electrically connect the oppositely arranged first and second connecting terminals together in this circuit board. The adhesive contains at least a three-dimensional cross-linking resin and a thermoplastic resin having the water absorption coefficient of 0.05-O.25 wt.% and the glass transition temperature of 110-160 deg.C. The thermoplastic resin is a special polysulfone resin and preferably dissolved in an aromatic hydrocarbon solvent.
申请公布号 JP2000285730(A) 申请公布日期 2000.10.13
申请号 JP19990091614 申请日期 1999.03.31
申请人 HITACHI CHEM CO LTD 发明人 OTA SATORU;WATANABE ITSUO;NAGAI AKIRA;TAKEMURA KENZO
分类号 H01L23/14;C08G75/23;C09J7/00;C09J9/02;C09J163/00;C09J181/06;C09J201/00;H01B1/20;H05K1/18;H05K3/32;(IPC1-7):H01B1/20 主分类号 H01L23/14
代理机构 代理人
主权项
地址
您可能感兴趣的专利