摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which uses an adhesive having a low hygroscopic property and high heat resistance. SOLUTION: A first circuit member having a first connecting terminal and a second circuit member having a second connecting terminal are arranged with first and second connecting terminals facing each other, and an adhesive is provided between the first and second connecting terminals arranged face to face and is heated and pressed to electrically connect the oppositely arranged first and second connecting terminals together in this circuit board. The adhesive contains at least a three-dimensional cross-linking resin and a thermoplastic resin having the water absorption coefficient of 0.05-O.25 wt.% and the glass transition temperature of 110-160 deg.C. The thermoplastic resin is a special polysulfone resin and preferably dissolved in an aromatic hydrocarbon solvent.
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