| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a control method and control system for exposure apparatus capable of detecting apparatus abnormalities leading to quality trouble with high probability in real time. <P>SOLUTION: The exposure apparatus control method according to the embodiment comprises the step of: retrieving from the database the correction amount of alignment correction at the time of exposure of a wafer and the inclination amount of the wafer stage with respect to the optical axis of the exposure optical system at that exposure time; the step of making a determination on the inclination amount based on a predetermined condition; the step of making a determination on the correction amount based on a predetermined condition; and the step of issuing an alarm when the inclination amount and the correction amount both satisfy the predetermined condition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
