| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for handling a semiconductor wafer capable of easily handling a thin semiconductor wafer while inexpensively securing the strength and the rigidity of the thin semiconductor wafer. <P>SOLUTION: A surface 2 of a support substrate 1 is freely attachably/detachably adhered to a weak adhesive surface 11 of a flexible adhesive layer 10, a strong adhesive surface 12 of the adhesive layer 10 is freely attachably/detachably adhered to a thin semiconductor wafer W, and the support substrate 1 is integrated with the thin semiconductor wafer W, thereby the thin semiconductor wafer W is handled by providing the strength and the rigidity to the thin semiconductor wafer W. Thereby the equipment investment is suppressed to the minimum, the strength and the rigidity of the thin semiconductor wafer W are secured and the thin semiconductor wafer W can be handled safely and inexpensively, because there is no need to use a dedicated holding jig and related equipment. <P>COPYRIGHT: (C)2012,JPO&INPIT |
