发明名称 |
Integrated circuit system employing back end of line via techniques |
摘要 |
An integrated circuit system that includes: providing a substrate including front-end-of-line circuitry; forming a first metallization layer over the substrate and electrically connected to the substrate; forming a viabar or a via group over the first metallization layer; and forming a second metallization layer over the first metallization layer and electrically connected to the first metallization layer through either the viabar or the via group. |
申请公布号 |
US8115276(B2) |
申请公布日期 |
2012.02.14 |
申请号 |
US20080132342 |
申请日期 |
2008.06.03 |
申请人 |
ZHANG SHAOQING;ZHANG FAN;CHU SHAO-FU SANFORD;ZHANG BEI CHAO;GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
发明人 |
ZHANG SHAOQING;ZHANG FAN;CHU SHAO-FU SANFORD;ZHANG BEI CHAO |
分类号 |
H01L21/283;H01L21/02;H01L29/92 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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