| 摘要 |
PURPOSE:To offer an integrated circuit device in which a metal conductor layer and a metal ball are not cut and whose reliability is high by a method wherein a thin protective film having an opening part is formed on a bonding pad part of the metal conductor layer. CONSTITUTION:A metal conductor layer 1 is formed on an interlayer insulating layer 5. Then, the whole surface of the interlayer insulating film 5 is covered with a protective film 2; and an opening is made on the bonding pad part of the metal conductor layer 1. Then, the whole surface on it is covered with a thin protective film 3; and an opening part which is smaller than that in the protective film 2 is formed near the central part of the bonding pad part of the metal conductor layer 1. In addition, a metal ball 6 and the bonding pad part of the metal conductor layer 1 are bonded and connected near the central part so as to sandwich the thin protective film 3 at the circumference. By using a structure in which the metal ball and the bonding pad part of the metal conductor layer are connected in the upper part and the lower part so as to sandwich the thin protective film, it is possible to prevent moisture from creeping in from the outside. As a result, the reliability of an integrated circuit can be increased. |
