| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package in which a semiconductor device and a substrate are electrically connected via solder balls, which is advantageous for density growth of solder balls without high growth in sizes of the semiconductor device and the substrate. <P>SOLUTION: The semiconductor package comprises a semiconductor device 20 on which pads 21 are disposed in a lattice pattern on one face. The pads 21 include a ball formation pad 21a to which a solder ball 30 is connected and an empty pad 21b to which a solder ball 30 is not connected. The ball formation pads 21a are disposed in a zigzag pattern and through holes 12 are provided on a substrate 10 on portions facing the empty pads 21b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
