| 摘要 |
PROBLEM TO BE SOLVED: To provide a placement stage capable of reducing surface resistance of a top plate to obtain stable measurement results, preventing leak current from the top plate, and reducing manufacturing costs. SOLUTION: The placement stage 20 according to the present invention comprises: a top plate 21 that is composed of oxygen-free copper and has a surface where a semiconductor wafer W is placed; a dielectric film 22 that is composed of alumina and consecutively covers the under face 21A of the top plate 21 and the lower portion of a side 21B thereof; and a cooling jacket 23 that is composed of oxygen-free copper and disposed to touch the dielectric film 22. COPYRIGHT: (C)2008,JPO&INPIT |
