PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and a plasma processing method capable of exciting a uniform plasma on a large-area substrate.

SOLUTION: A plasma processing apparatus 10 has: a vacuum container 100 having therein a mounting table 115 for mounting a substrate G, and a plasma space in which a plasma is generated above the mounting table; a first coaxial tube 225 that supplies a high frequency wave for exciting the plasma in the vacuum container 100; a waveguide 205 connected with the first coaxial tube 225, and that opens in a slit shape toward the plasma space; and adjusting means that adjusts a wavelength of the high frequency wave propagating in the waveguide 205 in a longitudinal direction of the slit-like opening. By setting the wavelength of the high frequency wave propagating in the waveguide 205 to be sufficiently long by the adjusting means, a uniform high frequency electric field can be applied to the slit-like opening along the longitudinal direction.

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