| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package manufacturing method, a package, a piezoelectric vibrator, and an oscillator capable of improving the location accuracy of a through electrode. <P>SOLUTION: A package manufacturing method includes a welding step of welding a wafer 40 for a base substrate to a rivet 30 while pressing and heating the wafer 40 for the base substrate from both sides of a thickness direction with a mold 60, forms a rivet storage part 67 that can store a tip of a core material part 28 in a receiving mold 63 of the mold 60, and forms an inner face of the rivet storage part 67 in a tapered shape that extends from a bottom side to an opening side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
