发明名称 Method of forming plated product using negative photoresist composition and photosensitive composition used therein
摘要 A method is provided that enables the formation of multiple level plated products with large plating depth. A negative photoresist composition comprising (a) an alkali-soluble resin, (b) an acid generator, and (c) other components is used, and a plated product is formed by (A) a step of forming a layer of this negative photoresist composition, and then either heating or not heating, before conducting exposure; (B) a step of repeating the step (A) so that the step is performed a total of 2 or more times, thereby superimposing layers of the negative photoresist, and subsequently developing all of these layers simultaneously to form a multilayer resist pattern; and (C) a step of conducting plating treatment within this multilayer resist pattern.
申请公布号 US8105763(B2) 申请公布日期 2012.01.31
申请号 US20050629017 申请日期 2005.05.10
申请人 MASUDA YASUO;WASHIO YASUSHI;SAITO KOJI;TOKYO OHKA KOGYO CO., LTD. 发明人 MASUDA YASUO;WASHIO YASUSHI;SAITO KOJI
分类号 G03F5/00;G03F7/00 主分类号 G03F5/00
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