ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE, METHOD OF FORMING FINE GOLD STRUCTURE USING SAME, AND FINE GOLD STRUCTURE FORMED USING SAME

摘要

An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 µm or smaller, in terms of the width of the exposed substrate area, and having a height of 3 µm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 µm or finer is formed therefrom.