| 摘要 |
<P>PROBLEM TO BE SOLVED: To maintain a predetermined height of a circuit board at the time of manufacturing a substrate without being influenced by warping of the substrate that occurs during soldering of the substrate and so on. <P>SOLUTION: The tallest electronic component is arranged nearby the center of the substrate 2, and an electronic component other than the tallest electronic component is arranged on the substrate so as to satisfy D≤C-B, where C is a height of the tallest electronic component, D is a height of the electronic component arranged at a position other than the center of the substrate, and B is an amount of warpage of the substrate in a length direction of the substrate at the position. Consequently, even when the substrate of the circuit board warps, a height W of the substrate never exceeds the value obtained by adding a thickness T of the substrate to the height C of the tallest electronic component, and an increase in height of the circuit board due to warpage of the substrate can be thereby suppressed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
