| 摘要 |
<p>PURPOSE: A lead pin for a semiconductor package and the semiconductor package are provided to improve combination efficiency by increasing the contact area of a head unit and a solder paste. CONSTITUTION: A connection pin is inserted into a hole formed in an external instrument. A head unit comprises a protrusion(124) of a multilayer shape and a flange part. The flange part(122) is formed in one end of the connection pin. A fence part(130) is formed in one side of the head unit so that a solder paste covers the top of the head unit when the heat unit mounting a package unit. The protrusion includes a plane part formed in the flange part and a round part on the plane part.</p> |
