| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die-bonding device which can improve the accuracy when die-bonding a semiconductor laser to a stem while suppressing contamination of and damages to the semiconductor laser. <P>SOLUTION: A die-bonding device has a pellet holding part (a collet 16) which holds a pellet 40 having a heat sink 17 and a semiconductor laser 18 mounted on the heat sink 17. The die-bonding device also has a positioning member 20 including a first plane 51 abutted on a predetermined reference plane 42 that is in a predetermined positional relationship with a stem 41, and a second plane 52 on which the heat sink 17 of the pellet 40 is abutted. By making a third plane 58 of the heat sink 17 abut on the second plane 52 with the reference plane 42 abutted on the first plane 51, a control part 70 executes a control operation to position the pellet 40 and a control operation to die-bond the positioned pellet 40 on the stem 41. <P>COPYRIGHT: (C)2012,JPO&INPIT |
