| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably connect a contact electrode and wiring. <P>SOLUTION: The semiconductor device comprises: a first wiring 40 including a first contact part 41 with a ring-shaped planar shape; a second wiring 50 disposed in a lower layer than the first wiring 40; and a contact electrode 60 that penetrates the ring-shaped portion of the contact part 41 and electrically connects the wiring 40 and the wiring 50. The semiconductor device also includes a wiring region provided on a substrate 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
