发明名称 Cooling structure, heatsink and cooling method of heat generator
摘要 A cooling structure includes a heat dissipation structure having a heat generator and a heatsink that is adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility; and a fluid flow path that is disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink may directly come into contact. Furthermore, on a surface of the heatsink that directly comes into contact with the cooling fluid, a fine recess is disposed.
申请公布号 US8061412(B2) 申请公布日期 2011.11.22
申请号 US20060520693 申请日期 2006.09.14
申请人 IPPOUSHI SHIGETOSHI;YAMADA AKIRA;MAEKAWA HIROTOSHI;YABUNAKA FUMIHARU;MITSUBISHI ELECTRIC CORPORATION 发明人 IPPOUSHI SHIGETOSHI;YAMADA AKIRA;MAEKAWA HIROTOSHI;YABUNAKA FUMIHARU
分类号 F28F7/00;H05K7/20 主分类号 F28F7/00
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