发明名称 PATTERN FORMATION METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern formation method and a method of manufacturing a semiconductor device, capable of forming a pattern in which a pattern region where pattern elements are periodically arrayed and a pattern region without such periodicity coexist with a high resolution. <P>SOLUTION: According to one embodiment of this invention, the pattern formation method comprises: a step of irradiating a mask with light from an illumination provided with a pair of main openings and four auxiliary openings which are at symmetrical positions regarding a first straight line connecting the centers of the pair of main openings and a second straight line orthogonal to the first straight line and are not on the first straight line, condensing zero-order diffracted light and first-order diffracted light diffracted by the mask, and exposing a resist film; and a step of forming a resist pattern in which a first pattern region where the pattern elements are periodically arrayed and a second pattern region without the periodicity are formed by developing the exposed resist film. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011233710(A) 申请公布日期 2011.11.17
申请号 JP20100102615 申请日期 2010.04.27
申请人 TOSHIBA CORP 发明人 TAMAKI SAYAKA;KAI YASUNOBU;MASHITA HIROMITSU
分类号 H01L21/027 主分类号 H01L21/027
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