发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 The density of a treatment fluid in exhaust gas is reduced, the amount of the treatment fluid that flows into exhausting equipment connected to a substrate treatment apparatus is reduced, and a load on the exhausting equipment is reduced. A substrate treatment apparatus includes: a substrate treating unit that treats a substrate; a treatment fluid supply unit that supplies, to the substrate treating unit, a treatment fluid used to treat the substrate; and an exhaust gas treating unit into which an exhaust gas containing the treatment fluid discharged from the substrate treating unit is introduced. The exhaust gas treating unit includes spray nozzles that spray a solvent toward the exhaust gas, the solvent dissolving the treatment fluid, thereby reducing the density of the treatment fluid in the exhaust gas. The exhaust gas treating unit has porous dispersion plates that cause the exhaust gas to disperse.
申请公布号 US2011259521(A1) 申请公布日期 2011.10.27
申请号 US200913127571 申请日期 2009.11.06
申请人 TOKYO ELECTRON LIMITED 发明人 HYAKUTAKE HIRONOBU;YAMASHITA KOJI;KAMITOMO SHINGO
分类号 C23F1/08 主分类号 C23F1/08
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