发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION AND METHOD FOR MANUFACTURING THEREOF |
摘要 |
A method for manufacturing an integrated circuit package system includes: providing a carrier; mounting an integrated circuit die on a top side of the carrier; connecting the integrated circuit die with the carrier; forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress; and forming a first external interconnect on the top side of the carrier adjacent to and separated from the encapsulation including forming a second external interconnect on a bottom side of the carrier opposite the first external interconnect.
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申请公布号 |
US2011260313(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US201113178347 |
申请日期 |
2011.07.07 |
申请人 |
YIM CHOONG BIN;KIM YOUNG CHEOL |
发明人 |
YIM CHOONG BIN;KIM YOUNG CHEOL |
分类号 |
H01L23/495;H01L21/56;H01L23/49 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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