| 摘要 |
<p>The present invention discloses an integrated patch unit, which comprises a circuit substrate, wherein the circuit substrate at least comprises at least a top circuit layer and a bottom circuit layer patched to each other, a peripheral element arranged on the top circuit layer, one electrode and the other electrode of the power supply, which are connected to the bottom circuit layer, a light emitting body connected with one electrode of the power supply, and a driving chip electrically connected with the light emitting body, the other electrode of the power supply or the both electrodes of the power supply respectively. Transparent packaging material is arranged on the circuit substrate and covered on the driving chip, the light emitting body or the whole surface of the top layer of the circuit substrate. The embodiments of the present invention integrates the driving chip, the light emitting body and the peripheral element to an integrated patch device with the characteristics of miniaturization, integration and cellular, thus implementing the batch production more easily.</p> |
