| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of difficulty in obtaining a configuration suited for non-contact communication and difficulty in obtaining a high reliability in an inspecting device for a semiconductor device.SOLUTION: An inspecting element for the semiconductor device includes a base material, an inspection circuit board disposed on the base material and having a circuit layer with an inspection circuit and a non-contact coupled circuit, and a support substrate connected with one principal plane of the inspection circuit board and having a through-electrode. |
