| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board mount, capable of preventing breakage of an engagement claw in engagement and reducing the number of work processes and work cost, in a configuration other than those including conventional formation of a built-part such as solder.SOLUTION: The manufacturing method is provided for a circuit board mount in which a component is mounted by causing an engagement claw 15 to engage with any one of an end face 3, a hole 8a, and a groove 8 of a circuit board 1 having been formed by press working or cutting. A chamfer 10 is formed by applying an edge such as the end face 3 by cutting or crushing work using a router 2 or punch 20, which are the same kind of tools as for press working or cutting. A tilt 1t of the engagement claw 15 is caused to slide on the chamfer 10, for smooth engagement between a component to which the engagement claw 15 is provided and the circuit board 1. |
