<p>Disclosed is a laser device (100) that suppresses heating and melting of a fiber-affixing section for affixing optical fibers, and that can suppress a decrease in the optical coupling rate between a semiconductor laser element and an optical fiber. The laser device (100) is provided with: a semiconductor laser element (2) having an exit surface (2a) from which laser light exits; an optical fiber (4) having an end section (4a) disposed in a manner so as to face the exit surface (2a) of the semiconductor laser element (2); and an optical fiber supporting member (5) that supports the optical fiber (4) and that has a bonding pad (7) that affixes the optical fiber (4) by means of solder (8). The optical fiber supporting member (5) has: a beam section containing a first primary surface at which the bonding pad (7) is disposed, and a second primary surface on the reverse side from the first primary surface; and a pillar section that is affixed to a pedestal (1), and that is bonded to the beam section at one end of the beam section, causing the second primary surface and the pedestal (1) to face each other while being spatially separated.</p>
