| 摘要 |
<p>The component (1) has a multi-layer printed circuit board (2) provided with electronic functional modules. The circuit board has a discharge layer (9) functioning as thermal discharge and electrical shielding layer. A functional module housing (10) is assigned to the respective modules for electrical shielding and connected with the discharge layer such that the housing forms a heat dissipation and shielding device (7) for the modules. The modules include separate earthed and operating voltage layers connected with the discharge layer, and are surrounded by a closed circuit path. An independent claim is also included for a space craft comprising an electronic component and a heat requirement mechanism.</p> |
