Transport apparatus e.g. rotating cylinder, for cooling soldered semiconductor wafers, has heating device formed such that warm air flow is partially oriented along path such that sloping temperature gradient is formed along path

摘要

The apparatus has a receiving unit receiving soldered semiconductor wafers (3), and a conveyor (2) transporting the receiving unit with the semiconductor wafers arranged in a wafer plane from a loading region of the apparatus into a removal region of the apparatus along a transportation path (T). A heating device produces warm air flow (4), and is formed such that the warm air flow is partially oriented along the transportation path such that sloping temperature gradient is formed along the transportation path. The heating device comprises a warm air flow emitter. An independent claim is also included for a method for cooling soldered semiconductor wafers.