发明名称 COOLING DEVICE AND ELECTRONIC DEVICE
摘要 The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal diffusion part makes thermal contact with the upper surface of the recessed part, the side surface of the thermal diffusion part makes thermal contact with the side surface of the recessed part, and the thermal diffusion part diffuses in the planar and orthogonal directions heat from the heat generating element arranged on the bottom surface of the thermal diffusion part by vaporizing and condensing coolant sealed inside.
申请公布号 WO2011072297(A3) 申请公布日期 2011.09.22
申请号 WO2010US60117 申请日期 2010.12.13
申请人 MOLEX INCORPORATED;NAGASAWA, HIDEO 发明人 NAGASAWA, HIDEO
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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