| 摘要 |
PROBLEM TO BE SOLVED: To smoothly form a contact surface of each of contact points, and to make contact resistance smaller between the contact points by surely contacting each of the contact points. SOLUTION: A fixed-contact section 33 has an adhesion layer 43 and a wiring layer 44 laminated on a fixed-contact substrate 41, and a contact layer 45 is formed thereon. An end surface opposite to the movable-contact section 34 of the contact layer 45 serves as a fixed contact 46 (a contact surface); and the fixed contact 46 is protruded from the wiring layer 44, the adhesion layer 43, and the fixed-contact substrate 41. A movable-contact section 34 has the adhesion layer 53 and the wiring layer 54 laminated on a movable-contact substrate 51, and the contact layer 55 is formed thereon. The end surface opposite to the fixed-contact section 33 of the contact layer 55 serves as a movable contact 56 (the contact surface); and the movable contact 56 is protruded from the wiring layer 54, the adhesion layer 53, and the movable-contact substrate 51. The fixed contact 46 and the movable contact 56 act as the surface in contact with the side of a molding section during the growing process of the contact layers 45, 55 through vapor deposition, sputtering and the like. COPYRIGHT: (C)2011,JPO&INPIT
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