| 摘要 |
PROBLEM TO BE SOLVED: To heat throughout the inside of a substrate as well as to prevent damage to a structure on the back of the substrate, in a machining method of cutting a glass substrate with a laser beam. SOLUTION: This is a method of cutting a substrate of a brittle material by irradiating it with a laser beam, which includes a first and a second step. In the first step, glass substrates 3, 4 are prepared in which an ITO film 12 is formed along a planned cutting line. In the second step, on the opposite side face to a face where the ITO film 12 is formed on the glass substrates 3, 4, irradiation along the planned cutting line is performed with a laser beam whose wavelength is 2.6-4.5μm so as to provide a transmittance 20-90% for the glass substrates 3, 4. COPYRIGHT: (C)2011,JPO&INPIT |
