发明名称 Electronic casing and method of manufacturing the same
摘要 An electronic casing and a method of manufacturing the same are provided. The method includes the following steps. Step (a): a metal laminate and a die of a predetermined shape are provided. The metal laminate comprises a metal top layer and a metal bottom layer that are bonded by interface atom diffusion. Step (b): the metal laminate is processed to form a casing blank by using the die, and the casing blank has at least one turning portion. Step (c): a profiler of a predetermined shape and an electromagnetic forming device are provided. Step (d): the casing blank is attached to the profiler, and the electromagnetic forming device is disposed at a position corresponding to the turning portion. Step (e): the electromagnetic forming device is activated, so that the casing blank has a shape corresponding to the predetermined shape of the profiler.
申请公布号 US8020423(B2) 申请公布日期 2011.09.20
申请号 US20070960795 申请日期 2007.12.20
申请人 METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE 发明人 CHEN CHIH-YUAN;WANG CHUN-CHIEH;SUE TZYY-KER;HUANG CHIN-CHUAN;CHUNG CHI-KEUNG
分类号 B21D31/00;B23P25/00;H01F7/06 主分类号 B21D31/00
代理机构 代理人
主权项
地址