发明名称 |
Electronic casing and method of manufacturing the same |
摘要 |
An electronic casing and a method of manufacturing the same are provided. The method includes the following steps. Step (a): a metal laminate and a die of a predetermined shape are provided. The metal laminate comprises a metal top layer and a metal bottom layer that are bonded by interface atom diffusion. Step (b): the metal laminate is processed to form a casing blank by using the die, and the casing blank has at least one turning portion. Step (c): a profiler of a predetermined shape and an electromagnetic forming device are provided. Step (d): the casing blank is attached to the profiler, and the electromagnetic forming device is disposed at a position corresponding to the turning portion. Step (e): the electromagnetic forming device is activated, so that the casing blank has a shape corresponding to the predetermined shape of the profiler.
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申请公布号 |
US8020423(B2) |
申请公布日期 |
2011.09.20 |
申请号 |
US20070960795 |
申请日期 |
2007.12.20 |
申请人 |
METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE |
发明人 |
CHEN CHIH-YUAN;WANG CHUN-CHIEH;SUE TZYY-KER;HUANG CHIN-CHUAN;CHUNG CHI-KEUNG |
分类号 |
B21D31/00;B23P25/00;H01F7/06 |
主分类号 |
B21D31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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