发明名称 |
METHOD OF THERMAL DENSITY OPTIMIZATION FOR DEVICE AND PROCESS ENHANCEMENT |
摘要 |
The present disclosure provides an integrated circuit method. The method includes providing an integrated circuit (IC) design layout; simulating thermal effect to the IC design layout; simulating electrical performance to the IC design layout based on the simulating thermal effect; and performing thermal dummy insertion to the IC design layout based on the simulating electrical performance.
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申请公布号 |
US2011214101(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
US20100713902 |
申请日期 |
2010.02.26 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHENG YING-CHOU;OU TSONG-HUA;HSU CHIH-WEI;TSAI CHENG-LUNG;LIU RU-GUN;HUANG WEN-CHUN;LUO BOREN |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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